IMHO, this doesn't look like something of real practical value, except for perhaps some very narrowly defined applications. I have doubts that a circuit prototyped in such a way will be of more value than the traditional methods (breadboarding, etching, etc..) It's limited to single side, making it unusable for anything remotely complex, still need to drill for through-hole components, still need to place SMD components, and hand soldering will be a must, as the final product probably won't stand up to the reflow process. In my opinion, directly printing an inverted design onto a copper coated substrate, and tossing it into some agitated ferric chloride would be a faster, easier and higher quality solution.
Looks like a high cost / effort to benefit ratio, but the project was funded, so maybe I'm missing something.